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Micro Focus X Ray Inspection System HS-ST-90/130/150 for BGA PCB SMT Electronics Industrial CT

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Micro Focus X Ray Inspection System HS-ST-90/130/150 for BGA PCB SMT Electronics Industrial CT

Name: Micro Focus X Ray Inspection System HSST90130150 for BGA PCB SMT Electronics Industrial CT
Brand: HUIWEI
Price: 1 USD

Quality Micro Focus X Ray Inspection System HS-ST-90/130/150 for BGA PCB SMT Electronics Industrial CT for sale

Overall Dimensions (WxDxH) : 1100 x 1100 x 2100 mm

Detector Frame Rate : 18 fps

Software - CNC Inspection : Single-point and matrix programming with graphical results

Power Supply : 380 VAC / 50 Hz

Tube Voltage : 90 / 130 / 150 kV (optional)

Payment Terms : T/T, L/C

Max Inspection Area : 330 x 330 mm

Place of Origin : Zhejiang, China

Certification : ISO 9001, CE

System Magnification : > 500X

System Type : Industrial CT / Micro-Focus X Ray Inspection System

Supply Ability : 100 Sets per Month

Delivery Time : 20-30 working days

Packing Dimensions (WxDxH) : 1300 x 1300 x 2300 mm

Weight : Approx. 1500 kg

Tube Current : 0.1 - 500 uA

Detector Pixel Matrix : 1172 x 1260

Brand Name : HUIWEI

Minimum Focal Spot Size : <= 10 um

Max Tilt Angle : Rotating swing arm up to +/-60 degrees

Applications : PCB/PCBA, SMT, BGA/CSP/Flip chip/QFN, electronic components, lithium battery, encapsulation, R&D labs

Software - Image Stitching : Stitching for large PCB/PCBA samples

Warranty : 12 Months

MOQ : 1 Set

Packaging Details : Standard export plywood case with shockproof protection

Model : HS-ST-90/130/150

Software - Auto Void Analysis : Automatic void/bubble measurement for BGA, QFN with report export

Price : Negotiable

Max Output Power : 8 / 60 / 65 W

Model Number : HS-ST-90/130/150

Detector Pixel Size : 49.5 um

Software - Navigation : Quick positioning on the physical image

Software - Measurement Tools : Distance, angle, diameter, polygon geometry measurement

Detector Type : CMOS

Max Object Size : Phi460 x 560 mm

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Product Introduction

The HS-ST-90/130/150 Industrial CT / Micro-Focus X-Ray Inspection System is a cost-effective, professional-grade non-destructive testing solution designed for precision electronics manufacturing and R&D. Equipped with a high-resolution imaging chain (CMOS detector, ≤10um micro-focus X-ray source and >500X system magnification), it clearly captures tiny defects in BGA, CSP, Flip chip, QFN packages and PCB boards, as well as components such as ICs, capacitors and resistors. Multi-angle observation and automatic void (porosity) analysis make it an all-in-one solution for high-precision, high-efficiency and high-safety inspection.

Micro Focus X Ray Inspection System HS-ST-90/130/150 for BGA PCB SMT Electronics Industrial CT

Core Selling Points

Micro-focus source: minimum focal spot ≤10um for sharp, high-resolution images
Multi-energy options: 90 / 130 / 150 kV selectable to suit different sample densities
Powerful magnification: system magnification >500X for micro-defect detection
High-speed CMOS detector: 1172 × 1260 matrix, 49.5um pixel, 18 fps imaging
Multi-angle observation: rotating swing arm with up to ±60° tilt
Automatic void analysis: auto bubble/porosity measurement for BGA, QFN with report export
Image stitching: stitch large PCB / PCBA samples into one full-field image
CNC automatic inspection: single-point & matrix programming with graphical results
Cost-effective turnkey CT: an economical complete system for end users and R&D labs

Technical Parameters

Whole Machine

Dimensions (W × D × H)	1100 × 1100 × 2100 mm
Packing Dimensions (W × D × H)	1300 × 1300 × 2300 mm
Weight	Approx. 1500 kg
Power Supply	380 VAC / 50 Hz

X-Ray Source

Tube Voltage	90 / 130 / 150 kV (optional)
Max Output Power	8 / 60 / 65 W
Tube Current	0.1 – 500 uA
Minimum Focal Spot Size	≤ 10 um

Detector

Detector Type	CMOS
Pixel Size	49.5 um
Pixel Matrix	1172 × 1260
Frame Rate	18 fps
Max Tilt Angle	Rotating swing arm up to ±60°
System Magnification	> 500X

Software System

Navigation	Quick positioning on the physical image
Auto Analysis	Automatic void/bubble measurement for BGA, QFN and other packages, with report export
Measurement Tools	Distance, angle, diameter, polygon and other geometry measurements
Image Stitching	Stitching for large samples such as PCB / PCBA, with save support
CNC Inspection	Single-point and matrix programming to quickly generate routines with graphical results

Motion Control System

Max Object Size	Φ460 × 560 mm
Max Inspection Area	330 × 330 mm

Applications

Ideal for end users performing precision electronics and NDT inspection:

PCB / PCBA and SMT assembly inspection
BGA, CSP, Flip chip and QFN package void analysis
Electronic components, IC, capacitor and resistor inspection
Lithium battery inspection
Encapsulation testing and quality control
R&D and test laboratories

Company Profile

Hangzhou Huiwei NDT Equipment Co., Ltd. is a national high-tech enterprise specializing in the R&D and manufacture of industrial X-ray and CT inspection equipment. With decades of experience in portable DR, CT and flaw detection products, we provide reliable imaging solutions to manufacturers, inspection companies and research institutions worldwide, and welcome end-user and OEM/ODM cooperation.

Shipping Information

Packaging: Standard export plywood case with shockproof protection, suitable for sea and air freight.
Delivery Time: 20–30 working days after order confirmation.
Shipping Terms: EXW / FOB / CIF available; sea freight recommended for this system.
Port: Shanghai / Ningbo, China.

After-Sales Service

12-month warranty on the X-ray source and detector.
On-site installation, commissioning and operator training available.
Lifetime technical support and software update guidance.
English operation manual and remote technical support.

Contact Us

For end users, R&D laboratories and system integrators, please send your inquiry now. Our team will reply within 24 hours with detailed quotation, configuration options and technical documents.

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